Astronauts won’t look bloated thanks to the Shrink-wrapping spacesuits

MIT shrink wrapping spacesuits

Surviving in outer space is not that easy as the astronauts have to cope up with changing atmospheric pressures and gravity level. To handle atmospheric pressure levels astronauts wear spacesuits with mechanical pressure produced by gas. But that could be soon changing as researchers at MIT headed by Dava Newman, a professor of aeronautics and astronautics and engineering systems have come up with the Shrink-wrapping spacesuits that will eliminate the need to wear bulky spacesuits. These spacesuits behave like second skin as it is a compression garment made-up of small spring-like coils and passive elastics that contract when exposed to heat.

The biggest advantage of these space suits is their ability to give the astronaut ultra-mobility and feeling of light-weightlessness when going out on planetary exploration. Applying heat to the spacesuit contracts it, thereby whenever there is need for pressure on the skin, the mechanism triggers the garment to contract and when pressure is not needed it contracts back.

The team choose nickel-titanium shape-memory alloys because of its ability to retain the original shape when the stimulus to contract is absent. Their only quandary for now is to figure out the way in which the heat has to be applied since the person wearing it has to be shielded from the heat too.

Not only spacesuits, but this NASA funded research technology could come handy for development of fabric embedded with sensors that would tighten if the soldier would have an injury in the battlefield and is bleeding profusely.

Source: MIT



Hailing from the northern region of India, Gaurav has a profound liking for everything upbeat in the cloud and vision to acquaint readers with the latest technology news. He likes to observe nature, write thought provoking quotes, travel places, drive cars and play video games when things get too boring. And his food for thought comes from ambient music scores he listens to.

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